IO-Link enabled communication for modern, digital device connectivity.

Simplified wiring architecture with fewer cables and faster installation.

Advanced diagnostics with detailed device-level data.

Remote monitoring and remote configuration capability.

Automatic parameter loading for quick and consistent device replacement.

Improved data availability for deeper process insight and analytics.

Designed for smart-factory environments and Industry 4.0 integrations.

Backward compatible with traditional manual inspection workflows.

Greater diagnostic granularity — MX III provides deeper device health and performance data.

Remote access capabilities, whereas MX II requires local checks and manual verification.

Automatic device configuration, unlike MX II’s manual parameter setup.

Cleaner and faster installation thanks to IO-Link’s reduced wiring requirements.

Enhanced integration potential with modern smart-factory software and control systems.

More efficient device replacement, minimizing downtime compared to MX II’s manual process.

Better scalability for multi-unit, multi-line environments needing real-time data.

Reliable pacing and inspection console for traditional manual inspection setups.

Uses standard wiring and basic digital/analog signals.

Limited diagnostics and IO-Link connectivity.

Best suited for simple, standalone inspection environments.